发明名称 INSPECTION METHOD FOR SOLDER CONNECTION STRUCTURE, AND SOLDER CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an inspection method for a solder joint structure having high joint strength obtained by solder joint that can easily distinguish good solder joint status from the bad status, and its solder joint structure. SOLUTION: As for the inspection method for solder joint structure of this invention, the deposit status of solder portion 5 covers the whole primary land portion 2a in the case where the melting of solder is in a perfect condition, while the deposit status of the solder portion 5 covers the whole secondary land portion 4b in the case where the melting of solder is insufficient and in a bad condition. The difference between the above cases in the deposit status of the solder portion 5 is large, and the distinction can be made easily. As the area of the primary land portion 2a has been made large, solder joint having high joint strength can be obtained. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007324528(A) 申请公布日期 2007.12.13
申请号 JP20060156140 申请日期 2006.06.05
申请人 ALPS ELECTRIC CO LTD 发明人 TAKEDA SHUICHI;HONMA TOMOYUKI
分类号 H05K3/34;B23K1/00;B23K101/42;H05K1/18 主分类号 H05K3/34
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