发明名称 |
APPARATUS FOR DEPOSITING THIN FILM AND METHOD OF DEPOSITING THE SAME |
摘要 |
Provided are an apparatus for depositing a thin film using plasma which can prevent impurities from being formed by inhibiting plasma from being diffused into a nozzle pipe and sustained in the nozzle pipe and improve thickness uniformity of the deposited thin film and a method of depositing the same. The apparatus for depositing a thin film includes a chamber having a substrate holder and an inner space defined by an inner wall; and a nozzle pipe comprising a first end fixed to the inner wall of the chamber; a second end extending into the inner space of the chamber; a flow path penetrating the nozzle pipe from the first end to the second end; and at least one slit which is disposed at the second end and opens the flow path into the inner space of the chamber.
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申请公布号 |
US2008095953(A1) |
申请公布日期 |
2008.04.24 |
申请号 |
US20070923395 |
申请日期 |
2007.10.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE HEOK-JAE;CHO JUNG-HUN;CHO SE-HWI;YANG YUN-SIK;LIM YONG-GYU |
分类号 |
C23C16/00;H05H1/24 |
主分类号 |
C23C16/00 |
代理机构 |
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地址 |
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