| 摘要 |
The device has an imaging optic (9) for imaging an object field (5) into an image field (10). A structure-prone mask (7) is arranged by a reticle holder (8) in a reticle scanning direction (21) in a region of an object plane (6) of the imaging optic. The mask includes a measuring structure imaged on a sensor device. The sensor device comprises a sensor line with sensor elements. The sensor device is formed to examine the imaging optic during shift of a substrate holder (13) for exposure on a wafer (12). Independent claims are also included for the following: (1) a method for examination of an imaging optic (2) a method for manufacturing micro- or nanostructure components. |
