| 发明名称 |
Semiconductor Device Having a Chip Under Package |
| 摘要 |
A semiconductor device package includes an electronic component and an electrical interconnect. The electronic component is attached to the electrical interconnect. The electrical interconnect is configured to electrically couple the electronic component to external terminals of the semiconductor device package. The electrical interconnect has a first main face facing the electronic component and a second main face opposite the first main face. The semiconductor device package further includes a first semiconductor chip facing the second main face of the electrical interconnect. |
| 申请公布号 |
US2016225745(A1) |
申请公布日期 |
2016.08.04 |
| 申请号 |
US201615012086 |
申请日期 |
2016.02.01 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Beer Gottfried;Ossimitz Peter |
| 分类号 |
H01L25/065;H01L23/31;H01L25/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device package, comprising:
an electronic component; an electrical interconnect attached to the electrical interconnect, the electrical interconnect being configured to electrically couple the electronic component to external terminals of the semiconductor device package, the electrical interconnect having a first main face facing the electronic component and a second main face opposite the first main face; and a first semiconductor chip facing the second main face of the electrical interconnect. |
| 地址 |
Neubiberg DE |
