| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid state image pickup device with a structure capable of improving an image quality and a yield.SOLUTION: A solid stage image pickup device includes: a semiconductor substrate 10; a photodiode 1 formed on the semiconductor substrate 10 and photoelectrically converted; a pixel portion on which pixels constituted by the photodiode 1 are arranged; a first wiring 14 connected to the semiconductor substrate 10 of the pixel portion by a contact portion 17, and extending outside the pixel portion in a first direction; a second wiring 15 comprising a wiring layer different from that of the first wiring 14, and formed to extend outside the pixel portion in a second direction different from the first direction; and a contact portion 16 electrically connecting the first wiring 14 and the second wiring 15. |
