| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of increasing the thickness of a soldered edge part that is easily deteriorated during a heat cycle test with a simple configuration and improving a fatigue tolerance dose of solder.SOLUTION: A semiconductor device 1 has a plate-like base body 2 having rigidity, and a component 3 mounted on the base body 2 with solder 4. In the semiconductor device 1 of this invention, the base body 2 has a protrusion part 2A formed in an area one size smaller than the area of the component 3 on the surface mounted with the component 3. The component 3 is matched to the center of the protrusion part 2A to be soldered onto the base body 2. |
