HEAT CURABLE RESIN COMPOSITION FOR ENCAPSULATION, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a heat curable resin composition for encapsulation suitable for encapsulating between a substrate and a semiconductor chip by pre-supply system under filling, high in flowability, high in curable rate, high in heat resistance of a cured article and capable of suppressing defective conduction between the conductor chip and the substrate.SOLUTION: A heat curable resin composition for encapsulation is used for encapsulating gaps between a substance and a semiconductor chip mounted on the substrate in a face-down manner. The heat curable resin composition for encapsulation has an acryl resin which has at least one of five-membered ring and six-membered ring and is liquid at 25°C and an inorganic filler having maximum particle diameter of 10.0 μm or less. The acryl resin is in a range of 10 to 40 mass% and the inorganic filler is in a range of 60 to 90 mass% based on total amount of the acryl resin and the inorganic filler. The heat curable resin composition for encapsulation further contains organic peroxide having 1 min half-life temperature in a range of 120 to 190°C.SELECTED DRAWING: Figure 1