发明名称 CONDUCTIVE ADHESIVE, CONDUCTIVE ADHESIVE SHEET, AND WIRING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a conductive adhesive, a conductive adhesive sheet and a wiring device which use a conductive filler containing copper as a main component and realize cost reduction, stable viscosity of the conductive adhesive, good connection reliability and adhesive strength even after long-term exposure to moist heat environments, and good connection reliability even in a circuit with a high step of a ground wiring board through hole.SOLUTION: A conductive adhesive comprises a thermosetting resin (A) having a carboxyl group, an epoxy resin, a conductive filler (B) containing copper as a main component, a curative, and a silane coupling agent.SELECTED DRAWING: Figure 1
申请公布号 JP2016204628(A) 申请公布日期 2016.12.08
申请号 JP20160017663 申请日期 2016.02.02
申请人 TOYO INK SC HOLDINGS CO LTD 发明人 HAYASAKA TSUTOMU;NISHINOHARA SATOSHI;KOBAYASHI HIDENORI;MATSUDO KAZUNORI;YAMADA KANAKO
分类号 C09J201/08;C09J7/00;C09J9/02;C09J11/02;C09J163/00;C09J175/04;H05K9/00 主分类号 C09J201/08
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