| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which has low stress property and low out gas property in low temperature burning at 250°C or less and further can provide a cured film having good mechanical properties.SOLUTION: The resin composition is provided that contains: a copolymer of a polybenzooxazole precursor and alkali soluble polyimide, represented by the general formula (1); and a solvent, in the formula (1), Ris a bivalent organic group, Ris an organic group having an alkyl chain structure having 5 to 20 carbon atoms, Ris a tetravalent organic group, Ris bivalent organic group, l and m are each structural unit number, structural unit of A and B may be block or random copolymer, l>0, m>0 and l+m is in a range of thousand to ten million.SELECTED DRAWING: None |
