Method of reducing the amount of carbon in an interface between an epitaxial film and a Si substrate

摘要

A method for manufacturing a semiconductor device is disclosed herein by which the contamination of an epitaxial film-Si substrate interface with carbon can be solved without allowing boron to remain in the epitaxial film-Si substrate interface. The method for manufacturing a semiconductor device according to the present invention comprises a step of ion-implanting, into an Si substrate, an element or a compound which easily reacts with carbon, a step of removing a natural oxide film on the Si substrate, a step of annealing, at a temperature of 800 DEG C or less in a CVD device, the Si substrate which has been subjected to the ion-implantation and the removal of the natural oxide film by the above two steps, and a step of carrying out an Si epitaxial growth or an Si1-xGex epitaxial growth on the annealed substrate by the CVD device.