ORGANIC PACKAGES WITH SOLDERS FOR RELIABLE FLIP CHIP CONNECTIONS
摘要
An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin and bismuth. Embodiments include a bismaleimide-triazine epoxy laminate having a plurality of solder pads on the surface thereof where the solder pads contain no more than about 20 weight percent tin and has a reflow temperature of no greater than about 270° C.
申请公布号
EP1243026(A1)
申请公布日期
2002.09.25
申请号
EP20000942923
申请日期
2000.06.15
申请人
ADVANCED MICRO DEVICES INC.
发明人
MASTER, RAJ, N.;KHAN, MOHAMMAD, ZUBAIR;GUARDADO, MARIA;ANDERSON, CHARLES