发明名称 WORK HOLDING DEVICE AND LASER BEAM MACHINING APPARATUS USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a work holding device, which is small-sized, whose control is simplified, whose sealing part has a simple structure, and whose seal is free from being worn out, and to provide a laser beam machining apparatus using the same device. <P>SOLUTION: A work holding device 1 is provided with a chuck 5 for holding a work 9 and a chuck driving part for driving the chuck, and performs laser beam machining of the work by biaxially operating the chuck. The chuck driving part consists of a 1st motor 21 fixed to a base 2 and a 2nd motor 31 fixed to a 1st-motor moving part 25, and the chuck is fixed to a 2nd-motor moving part 35. An elastic seal 6 and a protective plate 4, which holds the seal, are provided around the chuck. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006341293(A) 申请公布日期 2006.12.21
申请号 JP20050170781 申请日期 2005.06.10
申请人 YASKAWA ELECTRIC CORP 发明人 ITABE TADAKI;HARADA TAKENORI
分类号 B23K26/10 主分类号 B23K26/10
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