| 摘要 |
An electronic device that enables securing excellent hollow structure and close air-tightness of the space between the substrate and the electronic component, without incurring degradation in production efficiency, is to be provided. The electronic device includes a mounting substrate, an electronic component mounted on the mounting substrate, and a resin film provided all over the mounting substrate, so as to cover the electronic component. The resin film has a shear viscosity equal to or more than 100 kPa.s and equal to or less than 1000 kPa.s and a flow length equal to or more than 100 mum and equal to or less than 1500 mum.
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