| 摘要 |
PROBLEM TO BE SOLVED: To automatically place vias on a printed circuit board so as to satisfy predetermined conditions. SOLUTION: A printed circuit board design support program causes a computer to execute a ground-conductive area identification step of identifying conductive areas which can be used as grounds of a printed circuit board having a plurality of conductive layers, an overlap conductive area extraction step (S103) of extracting overlap conductive areas in which the conductive areas identified in the ground-conductive area identification step two-dimensionally overlap with one another, and an automatic placement step of placing interlayer connection members configured to electrically connect at least two of the plurality of conductive layers in the overlap conductive areas extracted in the overlap conductive area extraction step at intervals within a predetermined distance. COPYRIGHT: (C)2010,JPO&INPIT |
