SEMICONDUCTOR DEVICE

摘要

To enable a semiconductor device excellent in usability to be provided. A semiconductor device has a main surface surrounded by a plurality of sides, a semiconductor chip having a plurality of electrode pads arranged over the main surface, and a plurality of leads coupled to the electrode pads by way of wires respectively. The electrode pads include a plurality of first electrode pads supplied with a plurality of bits temporally in parallel. The first electrode pads include second and third electrode pads. A fourth electrode pad different from the first electrode pads is arranged between the second and third electrode pads.

主权项

1. A semiconductor device comprising:
a semiconductor chip including a main surface surrounded by a plurality of sides, and a plurality of electrode pads arranged over the main surface; and a plurality of leads coupled to the electrode pads by way of a plurality of wires respectively, wherein the plurality of electrode pads include a plurality of first electrode pads supplied with a plurality of bits in parallel, wherein the plurality of first electrode pads include second and third electrode pads, and wherein a fourth electrode pad different from the plurality of first electrode pads is arranged between the second and third electrode pads.