| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric element mounting package capable of mounting a different type of piezoelectric element, i.e., a crystal element or a SAW element, or a crystal element of different size, without preparing many kinds of piezoelectric element mounting packages corresponding to the type of the piezoelectric device.SOLUTION: A piezoelectric element mounting package 110 includes a rectangular substrate 110a, electrode pads 111 provided on the upper surface of the substrate 110a along one side thereof, bonding pads 114 provided on the upper surface of the substrate 110a along the side facing the one side, a first convex portion 115 provided on the upper surface of the substrate 110a at a position between the electrode pad 111 and bonding pad 114, and a second convex portion 116 provided between the bonding pads 114.SELECTED DRAWING: Figure 1 |
