FRAME FOR RESIN SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To inhibit wire-bonding failure in a frame where lead frames used for a batch mold type semiconductor device are arranged. SOLUTION: In this frame that is used for obtaining an individual resin sealed semiconductor device by aligning semiconductor devices on a die pad 3 that is supported by a suspension lead 2 on each lead frame 10, batch-molding the semiconductor devices, and then cutting the part of a grid lead L with a dicing saw, either a vertical or horizontal size (a) of a lead frame formation region B is equal to 35 mm or less. No flop occurs near the center of the lead frame formation region B, thus inhibiting the occurrence of wire bonding failure and preventing a resin from being routed to the rear in molding.