WIRING STRUCTURE, METHOD FOR FORMING THE SAME, AND DUAL DAMASCENE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a wiring structure with harmonized stress, and a method for fabricating it. SOLUTION: The wiring structure is composed of a substrate 100 having a conductive material 102. A composite dielectric layer 110 with at least one stress-harmonizing layer 106 interposed therein overlies a substrate 100. A conductive feature S in the composite dielectric layer 110 passes through the at least one stress-harmonizing layer 106 to electrically connect the conductive member 102. COPYRIGHT: (C)2007,JPO&INPIT