| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide simple conveying mechanisms as supply/discharge lines for works in a wire bonding system which targets a large-sized power module and places a plurality of wire bonding devices in operation simultaneously by improving spatial/temporal efficiency of an installed clean room. <P>SOLUTION: A wire bonding device 5 of the wire bonding system 1 has the work supply line 3 for conveying a work 2a before bonding, and a work discharge line 4 for conveying a work 2b after bonding in sequence. The wire bonding device is equipped with a bonder mechanism 7 which rotates, moves up and down, and two-dimensionally moves a bonding head 6, for bonding works 2; and the bonder mechanism 7 is arranged by a support member 8 above a conveyance path 6 for conveying the works from the work supply line 3 to the work discharge line 4. <P>COPYRIGHT: (C)2007,JPO&INPIT |
