发明名称 SEAL STRUCTURE OF HOUSING FOR ELECTRIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a seal structure of housing for an electric device that can directly seal a wire harness with a plurality of lead wires bundled using a resin grommet. SOLUTION: A harness lead-out hole 31 is provided in the housing 15 for the electric device. The wire harness 26 is also provided in which a plurality of the lead wires are bundled which are led outside the housing from the harness lead-out hole. The resin grommet 32 through which the wire harness passes is mounted into the harness lead-out hole with a gap 35. A gap between the resin grommet and the harness lead-out hole is sealed with a sealant 33 filled therein. Furthermore, the space between the resin grommet and the wire harness is sealed by a seal material 39. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008029074(A) 申请公布日期 2008.02.07
申请号 JP20060196628 申请日期 2006.07.19
申请人 ADVICS:KK 发明人 WATANABE MINORU
分类号 H02G3/08 主分类号 H02G3/08
代理机构 代理人
主权项
地址