| 摘要 |
According to the present invention, a semiconductor acceleration sensor fabricated using a semiconductor substrate comprises: an outer frame formed by the semiconductor substrate; a plurality of beam portions formed by the semiconductor substrate and connected to the outer frame; a first mass portion formed by the semiconductor substrate and connected to the beam portion; and a second mass portion connected to the end face opposite to the beam portion of the first mass portion. The second mass portion is formed of material having a higher specific gravity than the first mass portion.
|
