| 发明名称 |
Removal of integrated circuits from packages |
| 摘要 |
Packaging is substantially entirely removed from an integrated circuit die. The method allows the batch processing of several integrated circuit dies, such that packaging is removed from each die approximately simultaneously.
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| 申请公布号 |
US2008217773(A1) |
申请公布日期 |
2008.09.11 |
| 申请号 |
US20070716221 |
申请日期 |
2007.03.09 |
| 申请人 |
CHARLES STARK DRAPER LABORATORY, INC. |
发明人 |
PRYPUTNIEWICZ DARIUSZ R.;MARINIS THOMAS F.;TEPOLT GARY B. |
| 分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
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