METAL COVERED POLYIMIDE COMPOSITE, PROCESS FOR PRODUCING THE COMPOSITE, AND APPARATUS FOR PRODUCING THE COMPOSITE

摘要

This invention provides a metal covered polyimide composite, which can effectively prevent separation in an adhesive-free flexible laminate (particularly a two-layer flexible laminate), particularly can effectively suppress separation from the interface of a copper layer and a tin plating, and a process for producing the composite and an apparatus for producing the composite. The metal covered polyimide composite comprises a polyimide film, a tie-coat layer and a metal seed layer formed on a surface of the polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating. The metal covered polyimide composite is characterized in that the copper plating layer or the copper alloy plating layer comprises three to one copper or copper alloy layer.