发明名称 THIN FILM THERMOPHYSICAL PROPERTY MEASURING METHOD AND THIN FILM THERMOPHYSICAL PROPERTY MEASURING APPARATUS
摘要 <p>To provide a surface heating and surface temperature measuring thin film thermal diffusion factor measuring apparatus incorporating an analysis model wherein film thickness is taken into account and to quantitatively and simply measure a thin film formed on a discretionary substrate. The surface of a thin film (2) on a substrate (1) is instantaneously heated by using heating pulse light (3) to instantaneously increase the surface temperature. The heat diffuses into the thin film (2) and permeates inside the substrate (1), and the surface temperature of the thin film (2) is reduced. Temperature measuring pulse light (4) (P2) is applied to the same region where the heating pulse light (3) (P1) is applied (4a), and the intensity of its reflecting light (4b) slightly changes depending on the surface temperature. The temperature change of the surface of the thin film (2) can be detected by detecting such intensity change depending on the temperature by a detector (5). The detector (5) is provided with a light intensity sensor (5a) for measuring intensity of the reflecting light (4b), and an information processor (5b). The information processor (5b) incorporates a calculating section for calculating the thermal diffusion factor of the thin film, based on the analysis model wherein thin film thickness is taken into account.</p>
申请公布号 WO2009034787(A1) 申请公布日期 2009.03.19
申请号 WO2008JP63630 申请日期 2008.07.30
申请人 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCEAND TECHNOLOGY;TAKETOSHI, NAOYUKI;BABA, TETSUYA;YAGI, TAKASHI 发明人 TAKETOSHI, NAOYUKI;BABA, TETSUYA;YAGI, TAKASHI
分类号 G01N25/18 主分类号 G01N25/18
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