FILM FOR METAL FILM TRANSFER AND ADHESIVE FILM WITH METAL FILM

摘要

This invention provides a film for metal film transfer and a process for producing a circuit board using a film for metal film transfer, which can realize satisfactory removal of a residue (desmear) present on a via bottom. The film for metal film transfer is a film (10) for metal film transfer comprising a first metal layer (2) resistant to a copper etching liquid and a second metal layer (3) of copper or a copper alloy provided in that order on a support layer (1). The process for producing a circuit board comprises the step of providing a board comprising a copper layer or a copper alloy layer (a wiring) and a curable resin composition layer provided as a surface layer on the copper or copper alloy layer, superimposing and stacking a film (10) for metal film transfer on the board so that a second metal layer (3) is brought into contact with the curable resin composition layer, and curing the curable resin composition layer, the step of separating the support layer (1), the step of forming vias by a laser beam, the step of removing a via bottom residue, and the step of etching the surface of the via bottom substrate copper layer or copper alloy layer.