发明名称 METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE AND SUPPORT MATERIAL PRODUCED ACCORDING TO SAID METHOD
摘要 The invention relates to a method for producing an electrical conductive structure, in particular a conductor path, on a non-conductive support material which contains an additive having at least one metal compound. Said support material is at least partially exposed to electromagnetic radiation in order to activate the metal compounds contained in the additive, catalytically active germs thus forming in the activated areas with respect to an external, currentless metallization, said germs generating the electrically conductive structure on the non-conductive support material. During the method and prior to metallization, in order to efficiently and economically increase the proportion and the activity of the catalytically active germs, at least one part of the germs in the activated areas is substituted by a chemical exchange reaction by means of at least one catalytically active metal as an exchange metal. Also, the metallization takes place on the exchange metal and the optionally remaining, catalytically active germs in an external currentless metallization bath. As a result, in particular all two-step metallization processes become superfluous due to the fact that the claimed essentially increased catalytic activity allows a simple and fast metallization. The claimed method is suitable, preferably, also for plastic materials as support material which display a lower metallization suitability.
申请公布号 WO2016058594(A3) 申请公布日期 2016.06.16
申请号 WO2015DE100416 申请日期 2015.10.07
申请人 LPKF LASER & ELECTRONICS AG 发明人 KRÜGER, ROBIN ALEXANDER;RÖSENER, BERND;FENGLER, MALTE
分类号 H05K3/18;C23C18/16;C23C18/20;C23C18/30 主分类号 H05K3/18
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