Chip Substrate Provided with Joining Grooves in Lens Insert

摘要

A chip substrate includes: a plurality of conductive layers horizontally stacked and constituting the chip substrate; a plurality of insulation layers alternately with the conductive layers and electrically separating the conductive layers; a lens insert comprising a groove having a predetermined number of edges on the upper surface of the chip substrate and having a cross-section wherein an arc is formed at the region where the extended edges meet; a cavity comprising a groove reaching down to a predetermined depth towards the area accommodating the insulation layer within the internal region of the lens insert; and a plurality of joining grooves formed on the surface of the lens insert. Thus, the lens to be inserted also can be formed to be a shape comprising straight lines so that the manufacturing process of the lens to be inserted into the chip substrate can be further simplified.

主权项

1. A chip substrate provided with a plurality of joining grooves inside the lens insert comprising:
a plurality of conductive layers horizontally stacked and constituting said chip substrate; a plurality of insulation layers alternately with said conductive layers and electrically separating said conductive layers; a lens insert comprising a groove having a predetermined number of edges on the upper surface of said chip substrate and having a cross-section wherein an arc is formed at the region where the extended edges meet; a cavity comprising a groove reaching down to a predetermined depth towards the area accommodating said insulation layer within the internal region of said lens insert; and a plurality of joining grooves formed on the surface of said lens insert.