Methods and Apparatus for Glass Removal in CMOS Image Sensors

摘要

Methods for glass removal while forming CMOS image sensors. A method for forming a device is provided that includes forming a plurality of pixel arrays on a device wafer; bonding a carrier wafer to a first side of the device wafer; bonding a substrate over a second side of the device wafer; thinning the carrier wafer; forming electrical connections to the first side of the device wafer; subsequently de-bonding the substrate from the second side of the device wafer; and subsequently singulating individuals ones of the plurality of pixel arrays from the device wafer. An apparatus is disclosed.

主权项

1. A method for forming a device, comprising:
forming a first plurality of photo-sensitive elements in a semiconductor wafer, the semiconductor wafer disposed at a first major surface of a dielectric structure; forming a second plurality of photo-sensitive elements over a second major surface of the dielectric structure opposite the first major surface; bonding a substrate to the second major surface of the dielectric structure; thinning the semiconductor wafer at a first surface thereof to expose a conductive element formed within the semiconductor wafer; and forming electrical connections to the exposed conductive element at the first surface of the semiconductor wafer.