| 摘要 |
PROBLEM TO BE SOLVED: To provide a hole-filled substrate capable of suppressing the occurrence of swelling or peeling of a surface conductive film in a filled hole part even when being heated.SOLUTION: The hole-filled substrate comprises: an insulating substrate 2 having a hole part; a conductive via-hole part 3 formed by a conductive filler filled in the hole part; and a surface conductive film 4 formed in a region including the conductive via-hole part and overlying the insulating substrate. The surface conductive film is superposed on the insulating substrate so that the conductive via-hole part is exposed partially. The hole part may be a through-hole. The surface conductive film may include a plating film. The conductive via-hole part may be exposed at an areal percentage of 50% or less (especially at 5-20%). The surface conductive film may have an opening in a substantially center region of the conductive via-hole part. The hole part may have a circular sectional shape in a plane in parallel with a direction of a substrate surface of the hole part, and the opening of the surface conductive film may be circular in shape. The conductive filler may be a baked product of a conductive paste. |
