BONDING APPARATUS AND METHOD FOR DISPLAY DEVICE

摘要

A bonding device for a display device according to one embodiment of the present invention includes a film bonding unit which bonds an anisotropic conductive film to a panel and a compressor which bonds a driving chip and a flexible printed circuit board to the panel. The compressor includes a compressing head in which a heat source is installed, a compressing tip which is attached to the lower surface of the compressing head and compresses the flexible printed circuit board to the panel, and a transfer unit which is attached to the upper surface of the compressing head and transfers the compressing head. The heat source can be installed on the upper surface of the compressing tip.