SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC WAVE SHIELD LAYER

摘要

A semiconductor package is provided with an electromagnetic wave shielding layer, and a conductive ground layer connected thereto. For example, in certain embodiments, the conductive ground layer is formed in a package substrate of the semiconductor package. The conductive ground layer may include a planar, or base portion, and a protruding, or lip portion. The planar or base portion as well as the protruding or lip portion may contact the electromagnetic wave shielding layer surrounding the semiconductor package.

主权项

1. A semiconductor package comprising:
a package substrate including a core formed of an electrically insulating material and an electrically conductive ground layer formed within the core; a plurality of external terminals positioned to electrically connect circuitry in the package substrate to an external device external to the semiconductor package; and one or more semiconductor chips stacked on and electrically connected to the package substrate; a mold member disposed on the package substrate and surrounding the one or more semiconductor chips; and an electromagnetic wave shield layer formed on side surfaces and on a top surface of the mold member and formed on side surfaces of the package substrate, wherein the conductive ground layer is electrically connected to at least a first terminal of the plurality of external terminals, the first terminal electrically connected to circuitry of the one or more semiconductor chips designated for connecting to a ground, and wherein the conductive ground layer has a plate shape, including a base portion and a lip portion formed of the same material, the lip portion extending above and/or below the base portion, and wherein a side of the base portion of the conductive ground layer and a side of the lip portion of the conductive ground layer form part of a side surface of the package substrate, and contact the electromagnetic wave shield layer.