| 摘要 |
Techniques for testing an electronic device with through-device vias can include using a probe card assembly with probes for contacting connection structures of the electronic device including ends of through-device vias of the electronic device. A pair of the probes can be electrically connected in the probe card assembly and can thus contact and form a direct return loop from one through-device via to another through-device via of a pair of the through-device vias with which the pair of probes is in contact. The electronic device can include test circuitry for driving a test signal onto the one of the through-device vias and a receiver for detecting the test signal on the other of the through-device vias. |
