发明名称 ヒートポンプ式加熱装置
摘要 PROBLEM TO BE SOLVED: To provide a heat pump type heating device efficiently cooling an electric component provided to a control part for controlling operation of a refrigerant circuit, with simple structure.SOLUTION: A heat pump type water heater includes a refrigerant circuit 20 constituting a heat pump cycle; and a control part 40 controlling operation of the refrigerant circuit 20. The refrigerant circuit 20 includes: a water heat exchanger 22 exchanging heat between a refrigerant and water; an air heat exchanger 24 exchanging heat between the refrigerant and air; and a compressor 21 compressing the refrigerant sent from the air heat exchanger 24. The control part 40 has a power semiconductor device 41. The refrigerant circuit 20 further includes an intermediate pipe 66 to which the refrigerant is supplied from the air heat exchanger 24 and returns the refrigerant to the air heat exchanger 24. The heat pump type hot water heater further includes a cooling part 51 cooling the power semiconductor device 41 by the refrigerant flowing through the intermediate pipe 66.
申请公布号 JP6029852(B2) 申请公布日期 2016.11.24
申请号 JP20120108574 申请日期 2012.05.10
申请人 シャープ株式会社 发明人 瀬津 道生
分类号 F25B1/00;F25B5/04;F25B47/02 主分类号 F25B1/00
代理机构 代理人
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