<p>A reactive hot melt adhesive and/or sealing composition having a heat of crystallization in joules/gram of -2 or lower, comprising a curable heat-flowable adhesive material and a particulate filler, wherein said composition has a thermal conductivity of less than 0.30 W/m. DEG C. The invention also relates to a method of using the adhesive/sealer composition described herein to fill a cavity or recess in a substrate and the filled substrates formed thereby.</p>
申请公布号
DE69504689(D1)
申请公布日期
1998.10.15
申请号
DE1995604689
申请日期
1995.07.14
申请人
MINNESOTA MINING AND MFG. CO., SAINT PAUL, MINN., US