发明名称 MOLD DEVICE FOR INJECTION MOLDING
摘要 <p>A mold device (S) for injection molding for forming a molding by injecting a molten resin material into a cavity (5) formed between a fixed die (10) of a fixed side mold (1) and a movable die (20) of a movable side mold (2) movable in the forward and backward directions. The fixed die (10) and the movable die (20) are formed of an aluminum alloy or a zinc alloy, and the mold (2) comprises the movable die (20), a backup plate (24) supporting the movable die (20), a spacer block (23), and a movable side mounting plate (22). Support bushes (25) are installed along the forward and backward movement direction of the mold to connect the backup plate (24) to the movable side mounting plate (22), and the support bush (25a) is disposed on an extension extending from a gate (4) in the forward and backward movement direction of the mold.</p>
申请公布号 WO2005070648(A1) 申请公布日期 2005.08.04
申请号 WO2005JP01016 申请日期 2005.01.26
申请人 TS TECH CO., LTD.;MAMADA SANGYO;MIYOSHI, YUJI;ARAKI, YUJI;YOSHIMARU, KENJI;MAMADA, TSUNEO 发明人 MIYOSHI, YUJI;ARAKI, YUJI;YOSHIMARU, KENJI;MAMADA, TSUNEO
分类号 B29C45/26;B29C33/38;(IPC1-7):B29C45/26 主分类号 B29C45/26
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