METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, SURFACE-EMITTING SEMICONDUCTOR LASER, SURFACE-EMITTING SEMICONDUCTOR LASER ARRAY, OPTICAL SCANNING APPARATUS AND IMAGE FORMING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing semiconductor chips by which the number of chips obtained from one substrate is larger than ever before. SOLUTION: A semiconductor laminate is composed of an off substrate (inclined substrate) which has a major surface (1 0 0) inclined by 15°in the direction of its crystal orientation [0 1 1] and several devices formed on it. It is cut along cutting lines which extend in the directions forming angles of 45°and 135°with the direction of cleavage, and is divided into several chips each of which has 9 devices. That is to say, the semiconductor laminate on which several devices are formed is cut in such a way that its cut surface may not include cleavage planes of the substrate. Accordingly, the size of chips is reduced and the number of chips obtained from one substrate can be increased in comparison with conventional methods. COPYRIGHT: (C)2008,JPO&INPIT