| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and a method for manufacturing the same component, wherein the component has a structure that a plating film is laminated on the front surface of an external electrode to which a cavity hole is formed opening to the front surface, and the plating film is adhered surely, even at a part where the cavity hole is formed to the front surface of external electrode and preventing entry of water content or the like to the internal side. SOLUTION: In the electronic component 1, external electrodes 7, 8 are formed on the external front surface of a ceramic laminated body 2 as an electronic component raw material, cavity holes 7a, 8a opening to the external surface of the external electrodes 7, 8 are filled with conductive materials 9, 10, and the plating films 11, 12 are formed so as to be bonded to the conductive materials 9, 10 and covering the cavity holes 7a, 8a. COPYRIGHT: (C)2008,JPO&INPIT
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