MULTILAYER PRINTED CIRCUIT BOARD WITH ELECTRONIC COMPONENTS BUILT-IN AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board with electronic components built-in in which the failure state of each wiring boards can be inspected before the multilayer printed circuit board is completed, so that multilayer printed circuit boards are stacked after electric components built-in circuit boards are manufactured.

SOLUTION: The multiple printed circuit board with electronic components built-in includes: a first printed circuit board 10 having electronic components built-in; an intermediate stacking layer 30 formed by passing a conductive bump 32 through an insulation layer 34 in a position corresponding to wiring pattern 12 formed in front surface of primary wiring substrate 10; and a second circuit board 20 formed a circuit pattern 22 thereon at a position corresponding to the conductive bump 32.

COPYRIGHT: (C)2008,JPO&INPIT