发明名称 ELECTRONIC COMPONENT MOUNTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting structure which reliably mounts an electronic component on a board in a simple manner by effectively preventing floating or falling of the electronic component when the electronic component is mounted on the board, and which minimizes the size of the board with lower risk of deteriorating an insulation performance between lead terminals. SOLUTION: A plurality of lead terminals are provided in their midway with projections which are protruded in a lead terminal projection direction and in a direction perpendicular to the spacing between the lead terminals. The plurality of lead terminals are bent at their midway into the projections of an arc shape so that the projections are protruded all in the same direction and base ends of the projections and ends thereof are linearly arranged. When the plurality of lead terminals are inserted into corresponding mounting holes in a board, the projections abut against the inner walls of the mounting holes on one end sides in such a manner that the lead terminals are restricted to the other end sides of the mounting holes and the projections are held in the mounting holes. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009049292(A) 申请公布日期 2009.03.05
申请号 JP20070215931 申请日期 2007.08.22
申请人 IKEDA ELECTRIC CO LTD 发明人 NISHIMOTO TETSUYA
分类号 H01L23/48 主分类号 H01L23/48
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