| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating undeposition material for plating which has superior fine-wiring wirability and insulation reliability, and to provide a printed wiring board formed by using the material. Ž<P>SOLUTION: Disclosed is the plating undeposition material for plating on which plating is not deposited when plated, and which is characterized in that, by reforming part of the plating undeposition material for plating through a reforming operation, the reformed portion is converted into a plating deposition part where a plating is deposited by plating. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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