| 摘要 |
Provided is a three-dimensional laminated wiring substrate which can be housed in a restricted space and enables highly reliable high-density wiring. A three-dimensional laminated wiring substrate (1) comprises a plurality of laminated three-dimensional wiring substrates (11, 12, 13). Each of the three-dimensional wiring substrates (11, 12, 13) has an insulating film (111) and a conductor pattern (112). The insulating film (111) is formed to constitute a three-dimensional solid plane. The conductor pattern (112) extends on the three-dimensional solid plane of the insulating film (111). |
