シリコン貫通ビア（ＴＳＶ）ウエハの研磨用研磨組成物およびその使用方法

摘要

PROBLEM TO BE SOLVED: To provide a polishing composition for polishing Through-Silicon Vias (TSVs), and a method of polishing TSV wafers using the same.SOLUTION: The polishing composition contains an organic alkaline compound, an oxidizing agent, chelating agent, silicon oxide abrasive particles, and a solvent. This polishing composition can be used to simultaneously polish Si and conductive materials and significantly save the necessary working-hour costs for polishing TSV wafers.