PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE SHEET, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A photosensitive resin composition which contains a compound represented by general formula (1). (In general formula (1), R1-R4 may be the same or different, and each represents a hydrogen atom or an organic group having 1-4 carbon atoms; and X represents a tetravalent organic group having two or more structural units represented by general formula (2) in the main chain.) (In general formula (2), R5 represents a hydrogen atom or an alkyl group having 1-20 carbon atoms, and a plurality of R5 moieties in one same molecule may be the same as or different from each other.) Provided is a photosensitive resin composition which enables the achievement of a cured film having low stress after being heated and fired, and which has excellent long-term stability, high sensitivity and high resolution.