POLYIMIDE-BASED ADHESIVE, FILM ADHESIVE, ADHESIVE LAYER, ADHESIVE SHEET, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD, AND MULTI-LAYER WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a novel polyimide-based adhesive providing an adhesive layer being satisfactory in heat-resistant adhesion and low dielectric properties and having a low loss modulus in the B stage.SOLUTION: A polyimide-based adhesive comprises: a terminal modified polyimide (1), which is a reaction product of an acid anhydride group terminated polyimide (A1), which is a reaction product of a monomer group (α) including an aromatic tetracarboxylic acid anhydride (a1) and a dimer diamine (a2), and a primary monoamine (A2) represented by general formula X-NH, where X represents a C1-22 hydrocarbon group; a crosslinking agent (2); and an organic solvent (3).SELECTED DRAWING: Figure 1