发明名称 |
MULTI-LAYER BARRIER FOR METALLIZATION |
摘要 |
A solar cell can include a substrate, a semiconductor region disposed in or above the substrate, and a conductive stack that includes a first conductive region, a multi-layer barrier region, and a second conductive region. |
申请公布号 |
US2016380126(A1) |
申请公布日期 |
2016.12.29 |
申请号 |
US201514751096 |
申请日期 |
2015.06.25 |
申请人 |
Barkhouse David Aaron Randolph;Johnson Todd Richards;Loscutoff Paul;Woehl Robert |
发明人 |
Barkhouse David Aaron Randolph;Johnson Todd Richards;Loscutoff Paul;Woehl Robert |
分类号 |
H01L31/0224;H01L31/18 |
主分类号 |
H01L31/0224 |
代理机构 |
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代理人 |
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主权项 |
1. A solar cell, comprising:
a substrate; a semiconductor region disposed in or above the substrate; and a conductive contact disposed on the semiconductor region, the conductive contact comprising:
a first conductive region disposed on the semiconductor region,a first barrier region disposed on the first conductive region,a second barrier region disposed on the first barrier region, anda second conductive region disposed over the second barrier region. |
地址 |
Menlo Park CA US |