ADHESIVE RESIN COMPOSITION, METHOD FOR PRODUCING ADHESIVE RESIN COMPOSITION AND CHIP-FORMED COIL PART

摘要

PROBLEM TO BE SOLVED: To obtain an adhesive composition capable of including ferrite powder in high packing density to enable the formation of a good closed magnetic circuit by using a polyimide resin having high heat-resistance. SOLUTION: The objective adhesive composition is produced by adding and mixing ferrite powder to a liquid matrix resin containing at least one kind of resin selected from (A) a polyamic acid resin and (B) a resin having imide bond, enabling addition reaction with an amine or self-polymerization and soluble in an organic solvent.