发明名称 |
INTERMEDIATE STRUCTURE TO BE MOUNTED WITH SEMICONDUCTOR, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To reform the warp of a circuit board and materialize stable connection reliability, by interposing a circuit board between plates A and B having openings corresponding to the positions where semiconductor elements A and B are to be mounted on both sides of the faces A and B of the circuit board, in a semiconductor mounting method which is used in the case of flip-chip- mounting semiconductor elements on both the face A and the face B of the circuit board. SOLUTION: Since the warp of a circuit board where semiconductor elements A and B are mounted is suppressed by providing an integrated structure of plate where a circuit board is interposed between the plates A1 and B2 having openings in the positions where the semiconductor elements A and B are to be mounted at the face A and the face B of the circuit board 3.
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申请公布号 |
JP2001326322(A) |
申请公布日期 |
2001.11.22 |
申请号 |
JP20000145603 |
申请日期 |
2000.05.17 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SUNAKAWA YOSHITAKA;HAYASHI YOSHITAKE;KANZAWA HIDEO;SHIRAISHI TSUKASA;YUHAKU SEI;AMAMI KAZUYOSHI |
分类号 |
H05K3/32;H01L21/56;H01L21/60;H01L23/12;H01L25/065;H01L25/07;H01L25/18;H05K3/34;(IPC1-7):H01L25/065 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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