PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To prevent short-circuiting failure caused by allowing an oxide layer that is formed on the surface of the wave of soldering jet to adhere to a soldering site when the electrode or lead of circuit parts that are packaged and mounted onto a printed circuit board is to be soldered in a flow soldering bath. SOLUTION: A disposal substrate 8 for eliminating the oxide layer having a division guidance part 7 is formed at a position that is set to the front of soldering when passing on a flow soldering bath 9, and at the same time allows solder to first come into contact with fluxing solder flow 22.