SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To increase strength at a pad part being touched by the probe terminal of an inspection equipment. SOLUTION: A second layer probe inspection pad metal 300 for laying a part of probe inspection pad in layer by lowering a first power supply main line 123 while ensuring a sufficient distance L2, and a contact 310 for touching the third and second layers of that probe inspection pad are arranged in an I/O cell 301.