发明名称 Carl for bioelectronics:substrate linkage using a conductive layer
摘要 The invention relates to a process for the production of biocompatible structures. For this purpose, a chemically amplified photoresist is applied to a substrate and is structured. The photoresist contains a first polymer which has anchor groups for linking a biocompatible compound and a second polymer which is electrically conductive. After the structuring of the resist, a solution of the biocompatible compound is applied so that the biocompatible compound is coordinated to the anchor groups of the polymer.
申请公布号 US2005042547(A1) 申请公布日期 2005.02.24
申请号 US20040491143 申请日期 2004.10.19
申请人 ELIAN KLAUS 发明人 ELIAN KLAUS
分类号 A61L33/00;G03F7/09;G03F7/40;(IPC1-7):G03C5/00 主分类号 A61L33/00
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